Jabil's roots lie in the assembly and testing of printed circuit boards. Today, from worldwide locations, we support high and low-mix PCB and backplane assembly for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to hundreds of thousands in volume production.
Our assembly services are complemented by front-end product development capabilities including strong CAD layout and design experience. And of course, quality is always first - we employ DFX fundamentals as well as quality and data-tracking methodologies.
PCB Capabilities
- 0201s
- CCGA
- COB
- CSPs
- Double sided, mirrored BGA assembly
- Double sided, single reflow processing
- Fine pitch high pin count press fit connectors
- Flip chip
- Lead-free assembly
- MCMs
- MEMs
- Mictor connectors
- uBGA
- Bare die attach
- Continuous flow SMT lines
Backplane Capabilities
- SMT - large scale backplanes up to 24" x 24"
- PTH (plated through hole) - up to 24" wide
- Press-fit - up to 12 ton, closed-loop systems
- Process chemistry - aqueous and no clean
- Test - up to 33,792 test nodes
