Our dedicated expertise from the Engineering and Technology Services (ETS) Penang led by Zambri Samsudin has successfully published several scientific papers in the international scientific journals and conferences in collaboration with the local universities. The team has reported on several interesting novel development and findings with regards to stretchable printed circuit, nano solder paste, Cu/Sn-9Zn/Cu lap joints shear strength evaluation, gold pre-tinning processes and electrochemical migration investigation on solder alloy. Below are the excerpts showing some of the work published by Zambri and the team. For more details on these published works, please contact Jasmine Ooi for facilitating technical discussions/interest with appropriate Jabil ETS personnel/expertise.
Abstract (Article Published in the Journal of Materials & Design):
This study investigates the effects of the addition of Fe2NiO4 nanoparticles into a SAC-305 leadfree solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe2NiO4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe2NiO4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe2NiO4 nanoparticles, respectively. If the addition of Fe2NiO4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely.
Abstract (Conference Proceedings):
Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO3 solution. The concentration of HNO3 solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analyze the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO3. The concentration of HNO3 solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO3 increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO3 solution is most susceptible to ECM. SnO2 forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO3 solution.