Our Platforms

CP150

 Our Platforms

A Flexible, High-Precision Automation Solution

The CP150 automation platform delivers future-proof flexibility to any production line by delivering a highly-modular, scalable system that addresses a variety of automation needs.

 Our Platforms

Enhanced Capabilities

Metrology. We design and deliver non-contact metrology solutions that increase production thoughput and repeatability.

Features:

  • Ability to identify cosmetic defects, coating thickness, gaps, and offsets
  • High-speed multi-angle light triggering
  • Custom AI Defect generation software

 

Optical Inspection. Our inspection capabilities allows you to identify and measure micron-level defects and surface flaws to ensure your products maintain the highest standards of quality.

Examples:

  • Cosmetic Defects
  • Coating Defects
  • Surface Finishes
  • Gaps and Offsets
  • Color and Gloss

 

Lamination. With the ability to align, place, and cure, our lamination capabilities delivers a streamlined process in your manufacturing processes.

Features:

  • Alignment repeatability within 10 microns
  • Scaleable for a variety of rigid and flexible material combinations
  • Non-contact “Bernoulli End-Effector” loading and unloading of materials
  • Automation Planarity Adjustment

 

High-Speed Final Assembly. When it comes to high-speed, high-precision assembly we deliver robust capabilities designed to help you achieve your manufacturing goals.

Examples:

  • Label Placement
  • Point-to-Point Soldering
  • Precision Dispensing
  • High-Speed Pick and Place
  • Vision Based Alignment
  • Robotic Screw Fastening

Key Features

 Our Platforms
  • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality levels
  • Modular Z-axis and Theta axis (optional) available
  • Multiple Vision location options (up-camera or down-camera)
  • Standardized mounting flanges and control interfaces
  • Quick-change feeder mounting available
  • OSHA and ANSI compliant

Key Benefits

 Our Platforms
  • High-Flexibility. The CP Series allows for a variety of configurations that can support any number of interrelated processes, production speeds, and quality levels. Configure pallet or edge-belt conveyors with a either a reversible left-to-right or right-to-left conveyor flow to optimize your manufacturing processes.
  • Multiple Levels of Automation. The platform supports a wide range of processes, ranging from semi-automatic to fully-automated modes, to help support your manufacturing objectives.
  • Redeployable. Future proof your investment by re-deploying the CP Series workcell for various applications. Common interfaces enables rapid change-over of applications; saving you time and money.

Specifications

Machine Footprint

  • 1495mm (w) x 1275mm (D) x 1800mm (H)

  • 1495mm (w) x 1275mm (D) x 2268mm (H) – With Light Tower

Work Envelope

700mm (X-axis) x 700mm (Y-axis)

Axes of Motion

  • 4 Axes (X, Y, Z, T) – Standard

  • 3 axes optional, Up to 16 axis compatible

Z Max. Stroke

100mm – Standard

Theta

360° – Standard

Manipulator Payload

Rated 3kg, Max. 6 kg (on Z-Axis) – Standard

Manipulator Repeatability

  • X, Y, Z ±25μm

  • T ±0.005°

Utility Requirements

  • Power 220VAC ±10%, 50/60Hz, 25 Amp

  • Air 5.2-6.9 bar, 57 L/min

Product Presentation

Edge Belt Conveyor, Pallet Conveyor, Manual Load, Dual Shuttle, Rotary Table

Feeder Slots Available

Feeders (Label, Tape, Reel, Tube), Tray Loader/Unloader, Manual Load Stack

Electrical I/O

  • User I/O – 24 VDC, 16 General Purpose Inputs / 16 General Purpose Outputs (NPN)

  • Expansion I/O – 16 Inputs / 16 Outputs per expansion card (NPN)

  • Remote I/O – 20 Inputs / 12 Outputs per Remote card (NPN)

Pneumatic

Remote valvebank(s) optional, Remote Vacuum Optional

MES Connectivity

Jabil ARVIS Visual Programming Environment

Controls

  • Chad IQps

  • Beckhoff TwinCAT3 Controller

  • ARVIS PC GUI

 

Chad IQps

 Our Platforms

The CHAD IQps™ is a low-cost automation platform that offers an ideal solution for odd-form pick-and-place and other circuit assembly applications. Easy-to-use motion and vision controls plus the incorporation of standard assembly tools provide great system flexibility.

  • EPSON 4-axis SCARA Robot with motion controller
  • Simple-to-use IQware™ application software and intuitive operator interface, via Windows PC and manual control pendant
  • Edge belt conveyor with board stop and board locating tooling, and board support
  • Optional Active or Programmable Lead clinch
  • Four quick-change feeder slots accept all standard Jabil Precision Automation part feeders
  • Options for 4, 6 and 10 feeders
  • Compatible with standard CHAD Grippers, including standard mechanical and vacuum grippers, plus the CHAD PIE™ compliant gripper
  • Ability to handle virtually all component types, including axial, radials, pin headers, DIPs, SIPs, transformers, relays, TO-220s, displays, LEDs, and more
  • Custom specifications can be accommodated
  • OSHA and ANSI compliant

 

Specifications
Machine Footprint
1118mm x 1600mm
Work Envelope
  • With Clinch Envelope 76mm x 76mm to 356mm x 240mm
  • With Board Support 76 x 76mm to 356 x 254mm
Axes of Motion
4 Axes (X, Y, Z, T)
Z Max. Stroke
180mm
Theta
360°
Manipulator Payload
Rated 3kg, Max. 6 kg (on Z-Axis)
Manipulator Repeatability
  • X, Y, Z ±50μm
  • T ±0.005°
Utility Requirements
  • Power 220VAC ±10%, 50/60Hz, 30 Amp
  • Air 5.2-6.9 bar, 57 L/min
 
Product Presentation
Edge Belt Conveyor
Feeder Slots Available
4 Slots (6 and 10 slots optional)
Electrical I/O
  • User I/O 56 Inputs / 48 Outputs
  • Expansion I/O 27 Inputs / 20 Outputs (expandable by using stackable modules)
Pneumatic
14 Valves Wired
MES Connectivity
Jabil IQware™ Visual Programming Environment
Controls
  • Advantech PC with Windows
  • Epson RC-180 Motion Controller
  • Epson Manual Control Pendant
 

WaferMate 300

 Our Platforms

The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling platform that mates high performance with cost competitiveness. As an ISO Class-2 clean EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.

Features

  • Pairs with all types of process tools and environments
  • Available in single and dual loadport configurations
  • Can service up to 3 process tools
  • 300mm automation platform, adaptable for 200mm and smaller substrates
  • Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-2
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • FOUP Opener
  • SMIF Pod Opener
  • Aligner
  • OCR
  • Barcode
  • RFID
  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station
  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Specifications
Machine Footprint

991mm (W) x 559mm (L) x 2063mm (T) (Single Loadport)
991mm (W) x 1041mm (L) x 2063mm (T) (Dual Loadport)

Wafer Alignment

to ± .05°

Wafer Placement

±100µm

Clean Room Classification

Up to ISO Class 2 (Optional)

Wafer Interface Options

SMEMA, SECS/GEM

Cassette Positions Available

Up to 4 x 200mm Cassettes

Loadport Positions Available

1 or 2

MTBF

60,000 hours

Compliance Standards

CE, SEMI S2, SEMI S8

Uptime

>97%

Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

 

WaferMate 200

 Our Platforms

The WaferMate200 is a high-performance wafer-handling platform, engineered for the expert automation of semiconductor wafers and similar substrates. The standard SMEMA interface provides the most cost-effective wafer-level process solution for systems that traditionally fit a conveyor layout.

Features

  • Pairs seamlessly with multiple types of process tools
  • Configurable for two, three or four cassette positions
  • Suitable for all open cassette presentation formats
  • Suitable for 50mm to 200mm wafers or 300mm from shipping cassette
  • Can accommodate film frames, and special thin and warped wafer components
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-4
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • Aligner
  • OCR
  • Barcode
  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station
  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Specifications
Machine Footprint

1194mm (W) x 769mm (L) x 1812mm (T)

Wafer Alignment

to ± .05°

Wafer Placement

±100µm

Clean Room Classification

Up to ISO Class 4 (Optional)

Wafer Interface Options

SMEMA, SECS/GEM

Cassette Positions Available

Up to 4 x 200mm Cassettes

MTBF

60,000 hours

Compliance Standards

CE, SEMI S2, SEMI S8

Uptime

>97%

Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

 

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