Our Platforms

CP150

 Our Platforms

 

A Flexible, High-Precision Automation Solution

The CP150 automation platform delivers future-proof flexibility to any production line by delivering a highly-modular, scalable system that addresses a variety of automation needs.

Enhanced Capabilities

 Our Platforms

Metrology

We design and deliver non-contact metrology solutions that increase production thoughput and repeatability.

  • Ability to identify cosmetic defects, coating thickness, gaps, and offsets
  • High-speed multi-angle light triggering
  • Custom AI Defect generation software

Optical Inspection

Our inspection capabilities allows you to identify and measure micron-level defects and surface flaws to ensure your products maintain the highest standards of quality.

  • Cosmetic Defects
  • Coating Defects
  • Surface Finishes
  • Gaps and Offsets
  • Color and Gloss

Lamination

With the ability to align, place, and cure our lamination capabilities delivers a streamlined process in your manufacturing processes.

  • Alignment repeatability within 10 microns
  • Scaleable for a variety of rigid and flexible material combinations
  • Non-contact “Bernoulli End-Effector” loading and unloading of materials
  • Automation Planarity Adjustment

High-Speed Final Assembly

When it comes to high-speed, high-precision assembly we deliver robust capabilities designed to help you achieve your manufacturing goals.

  • Label Placement
  • Point-to-Point Soldering
  • Precision Dispensing
  • High-Speed Pick and Place
  • Vision Based Alignment
  • Robotic Screw Fastening

Key Benefits

 Our Platforms

High-Flexibility

The CP Series allows for a variety of configurations that can support any number of interrelated processes, production speeds, and quality levels. Configure pallet or edge-belt conveyors with a either a reversible left-to-right or right-to-left conveyor flow to optimize your manufacturing processes.

Multiple Levels of Automation

The platform supports a wide range of processes, ranging from semi-automatic to fully-automated modes, to help support your manufacturing objectives.

Redeployable

Future proof your investment by re-deploying the CP Series workcell for various applications. Common interfaces enables rapid change-over of applications; saving you time and money.

Key Features

 Our Platforms
  • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality levels
  • Modular Z-axis and Theta axis (optional) available
  • Multiple Vision location options (up-camera or down-camera)
  • Standardized mounting flanges and control interfaces
  • Quick-change feeder mounting available
  • OSHA and ANSI compliant

Specifications

Machine Footprint

  • 1495mm (W) x 1275mm (D) x 1800mm (H)
  • 1495mm (W) x 1275mm (D) x 2268mm (H) – With Light Tower

Work Envelope

  • 700mm (X-axis) x 700mm (Y-axis)

Axes of Motion

  • 4 Axes (X, Y, Z, T) – Standard
  • 3 axes optional, Up to 16 axis compatible

Z Max. Stroke

  • 100mm – Standard

Theta

  • 360° – Standard

Manipulator Payload

  • Rated 3kg, Max. 6 kg (on Z-Axis) – Standard

Manipulator Repeatability

  • X, Y, Z ±25μm
  • T ±0.005°

Utility Requirements

  • Power 220VAC ±10%, 50/60Hz, 25 Amp
  • Air 5.2-6.9 bar, 57 L/min

Product Presentation

  • Edge Belt Conveyor
  • Pallet Conveyor
  • Manual Load
  • Dual Shuttle
  • Rotary Table

Feeder Slots Available

  • Feeders (Label, Tape, Reel, Tube)
  • Tray Loader/Unloader
  • Manual Load Stack

Electrical I/O

  • User I/O – 24 VDC, 16 General Purpose Inputs / 16 General Purpose Outputs (NPN)
  • Expansion I/O – 16 Inputs / 16 Outputs per expansion card (NPN)
  • Remote I/O – 20 Inputs / 12 Outputs per Remote card (NPN)

Pneumatic

  • Remote valvebank(s) optional
  • Remote Vacuum Optional

MES Connectivity

  • Jabil ARVIS Visual Programming Environment

Controls

  • Advantech PC with Windows 10
  • Beckhoff TwinCAT3 Controller
  • ARVIS PC GUI

 

SIM500

A Flexible, Cost-Effective Automation Solution

Jabil’s Standard Integration Module (SIM) platform utilizes interchangeable modules to automate basic to complex production applications. Pre-engineered solutions minimize risks, simplify integration, and reduce lead-time. SIM platforms can be used inline or as stand-alone work stations.

Features:

  • SIM is redeployable - designed with common interfaces enabling rapid change-over of applications

  • Platform supports a range of processes from semi-manual to fully automated

  • System can be fitted with pallet conveyor or edge belt conveyor, with reversible left-to-right or right-to-left conveyor flow

  • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality

  • Modular Z-axis and optional Theta axis

  • Vision location options (up-camera or down-camera)

  • Standardized mounting flanges and control interfaces

  • Quick-change feeder mounting

  • Full safety guarding (OSHA and ANSI compliant)

Applications

  • Label Placement

  • P2P Soldeirng

  • Screw Fastening

  • Vision Based Alignment

  • Precision Dispensing

  • Pick and Place

Options

  • XYZ Cartesian

  • Edge Belt or Pallet Conveyor

  • Pneumatic Shuttle (future)

  • Board Support (tall stroke)

  • Theta Axis on Manipulator

  • Vision Up-Camera or Down Camera

  • Barcode Reader

 

Specifications

Machine Footprint

  • 495mm (W) x 1363mm (D) 

Work Envelope

  • 300mm (X-axis) x 700mm (Y-axis)

Axes of Motion

  • 3 Axes (X, Y, Z)

Manipulator Payload

  • 6 kg (on Z-Axis)

Manipulator Repeatability

  • X, Y ±50μm

Utility Requirements

  • Power: 220VAC ±10%, 50/60Hz
  • Air: 6 bar, 25 L/min

Product Presentation

  • Edge Belt Conveyor (Standard)
  • Pallet Conveyor (Option)
  • Empty Deck (No Product Presentation)

Feeder Slots Available

  • 3 Ports (3 ins / 2 outs each)

Electrical I/O

  • 12 ins / 13 outs (Base)
  • Expansions: 8 ins / 8 outs
  • 9 ins / 4 outs (Robot for EOAT)

Pneumatic

  • Expandable via Ethernet I/O
  • 4 pre-wired valves (Deck)
  • 6 pre-wired valves (EOAT)
  • Expansions: 2 valves each

MES Connectivity

  • Jabil IQware™ Visual Programming Environment

 

Chad IQps

 Our Platforms

A Flexible, Cost-Effective Odd-Form Pick and Place Solution

The CHAD IQps™ is a low-cost automation platform that offers an ideal solution for odd-form pick-and-place and other circuit assembly applications. Easy-to-use motion and vision controls plus the incorporation of standard assembly tools provide great system flexibility.

Features:

  • EPSON 4-axis SCARA Robot with motion controller

  • Simple-to-use IQware™ application software and intuitive operator interface, via Windows PC and manual control pendant

  • Edge belt conveyor with board stop and board locating tooling, and board support

  • Optional Active or Programmable Lead clinch
  • Four quick-change feeder slots accept all standard Jabil Precision Automation part feeders
  • Options for 4, 6 and 10 feeders
  • Compatible with standard CHAD Grippers, including standard mechanical and vacuum grippers, plus the CHAD PIE™ compliant gripper
  • Ability to handle virtually all component types, including axial, radials, pin headers, DIPs, SIPs, transformers, relays, TO-220s, displays, LEDs, and more
  • Custom specifications can be accommodated
  • OSHA and ANSI compliant

 

Specifications
Machine Footprint
  • 1118mm x 1600mm
Work Envelope
  • With Clinch Envelope 76mm x 76mm to 356mm x 240mm
  • With Board Support 76 x 76mm to 356 x 254mm
Axes of Motion
  • 4 Axes (X, Y, Z, T)
Z Max. Stroke
  • 180mm
Theta
  • 360°
Manipulator Payload
  • Rated 3kg, Max. 6 kg (on Z-Axis)
Manipulator Repeatability
  • X, Y, Z ±50μm
  • T ±0.005°
Utility Requirements
  • Power 220VAC ±10%, 50/60Hz, 30 Amp
  • Air 5.2-6.9 bar, 57 L/min
Product Presentation
  • Edge Belt Conveyor
Feeder Slots Available
  • 4 Slots (6 and 10 slots optional)
Electrical I/O
  • User I/O 56 Inputs / 48 Outputs
  • Expansion I/O 27 Inputs / 20 Outputs (expandable by using stackable modules)
Pneumatic
  • 14 Valves Wired
MES Connectivity
  • Jabil IQware™ Visual Programming Environment
Controls
  • Advantech PC with Windows
  • Epson RC-180 Motion Controller
  • Epson Manual Control Pendant
 

WaferMate 300

 Our Platforms

High-Performance Wafer Handling Automation

The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling platform that mates high performance with cost competitiveness. As an ISO Class-2 clean EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.

Features

  • Pairs with all types of process tools and environments
  • Available in single and dual loadport configurations
  • Can service up to 3 process tools
  • 300mm automation platform, adaptable for 200mm and smaller substrates
  • Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-2
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • FOUP Opener
  • SMIF Pod Opener
  • Aligner
  • OCR
  • Barcode
  • RFID
  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station
  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Specifications
Machine Footprint
  • 991mm (W) x 559mm (L) x 2063mm (T) (Single Loadport)
  • 991mm (W) x 1041mm (L) x 2063mm (T) (Dual Loadport)
Wafer Alignment
  • to ± .05°
Wafer Placement
  • ±100µm
Clean Room Classification
  • Up to ISO Class 2 (Optional)
Wafer Interface Options
  • SMEMA
  • SECS/GEM
Cassette Positions Available
  • Up to 4 x 200mm Cassettes
Loadport Positions Available
  • 1 or 2
MTBF
  • 60,000 hours
Compliance Standards
  • CE
  • SEMI S2
  • SEMI S8
Uptime
  • >97%
Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

 

WaferMate 200

 Our Platforms

High-Performance Wafer Handling Automation

The WaferMate200 is a high-performance wafer-handling platform, engineered for the expert automation of semiconductor wafers and similar substrates. The standard SMEMA interface provides the most cost-effective wafer-level process solution for systems that traditionally fit a conveyor layout.

Features

  • Pairs seamlessly with multiple types of process tools
  • Configurable for two, three or four cassette positions
  • Suitable for all open cassette presentation formats
  • Suitable for 50mm to 200mm wafers or 300mm from shipping cassette
  • Can accommodate film frames, and special thin and warped wafer components
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-4
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • Aligner
  • OCR
  • Barcode
  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station
  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Specifications
Machine Footprint
  • 1194mm (W) x 769mm (L) x 1812mm (T)
Wafer Alignment
  • to ± .05°
Wafer Placement
  • ±100µm
Clean Room Classification
  • Up to ISO Class 4 (Optional)
Wafer Interface Options
  • SMEMA
  • SECS/GEM
Cassette Positions Available
  • Up to 4 x 200mm Cassettes
MTBF
  • 60,000 hours
Compliance Standards
  • CE
  • SEMI S2
  • SEMI S8
Uptime
  • >97%
Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

 

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